Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting unit

摘要

Provided are a light emitting device, a method for fabricating the light emitting device, a light emitting device package, and a lighting unit. The light emitting device (100A) includes a conductive support substrate (170), a first reflective layer (110) on the conductive support substrate (170), a second reflective layer (120) in which at least portion thereof is disposed on a side surface of the first reflective layer (110), a light emitting structure (145) including a first conductive type semiconductor layer (130), a second conductive type semiconductor layer (150), and an active layer (140) between the first conductive type semiconductor layer (130) and the second conductive type semiconductor layer (150) on the first and second reflective layers (110,120), and an electrode (160) on the light emitting structure (145). The second reflective layer (120) schottky-contacts the light emitting structure (145).