| 摘要 |
<p>An RFID tag (100) manufacturing method is including application process in which a heat-curable adhesive (104) is applied to an area where a circuit chip (103) is placed on a base to which antennae (102) are wired so as to be connected with the circuit chip, placement process in which the circuit chip is placed where the adhesive is applied, and thereby the circuit chip is connected with the antennae, covering process in which the circuit chip placed on the base is covered with a sheet member (105) having an adhesive layer on its surface, such that the adhesive layer faces the base, and heat and pressure applying process in which pressure is applied to the sheet member toward the base, and heat and pressure are applied to the circuit chip from above the sheet member, thereby curing the adhesive and fixing the circuit chip and the sheet member on the base.</p> |
