| 摘要 |
<p>This invention forms a contact having a large opposing area using a contact material of high hardness. An end face in the moving direction of a movable contact portion 34 and an end ace of a fixed contact portion 33 face each other. The fixed contact portion 33 has a buffer layer 44 and a conductive layer 45 alternately stacked in plural layers on the upper side of a fixed contact substrate 41 through vapor deposition, sputtering, electrolytic plating, and the like. The end facing the movable contact portion 34 of the conductive layer 45 is projected out than the end face of the buffer layer 44, and the end face of the conductive layer 45 becomes the fixed contact 46 (contacting surface). The movable contact portion 34 has a buffer layer 54 and a conductive layer 55 alternately stacked in plural layers on the upper side of a movable contact substrate 51 through vapor deposition, sputtering, electrolytic plating, and the like. The end facing the fixed contact portion 33 of the conductive layer 55 is projected out than the end face of the buffer layer 54, and the end face of the conductive layer 55 becomes the movable contact 56 (contacting surface).</p> |
