| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermocompression apparatus of a flexible wiring board where extension of a terminal array direction in a connection terminal string part of the flexible wiring board during heat compression bonding is adjusted, and a conduction connection defect due to thermal expansion of the flexible wiring board does not occur even in conduction bonding with a fine pitch connection terminal string of a mobile apparatus. <P>SOLUTION: In a depression head 7, a pair of depression sheet bunches 72a and 72b overlapped while a plurality of depression sheet boards 721 are erected by inclining them by anglesθand -θwith respect to a pressurizing direction P are arranged on both sides, across a center projection 712 which is protrusively disposed in a center of a surface 7111 turned to the pressurizing direction P of a substrate block 71. The pressurizing sheet bunches 72a and 72b are sandwiched with a pair of holding boards 73 and 73, a pair of holding blocks 74 and 74, and the center projection 712. Pressurizing faces 7a and 7b of the pressurizing sheet bunches 72a and 72b are finished in flat faces by a polishing processing. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
