发明名称 |
Method of manufacturing a flexible printed circuit assembly |
摘要 |
A flexible printed circuit assembly with a fluorocarbon dielectric layer and an adhesive layer with reduced thickness. The flexible printed circuit assembly includes a first dielectric layer and a signal trace disposed on the first dielectric layer. An adhesive layer with a thickness smaller than a height of the signal trace is disposed on the first dielectric layer, so that only a portion of a side surface of the signal trace is covered. A second dielectric layer made of fluorocarbon is disposed on the adhesive layer, covering a remaining portion of the side surface of the signal trace and a top surface of the signal trace.
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申请公布号 |
US8015701(B2) |
申请公布日期 |
2011.09.13 |
申请号 |
US20080035683 |
申请日期 |
2008.02.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ABRAHAMSON PAUL V.;DANGLER JOHN RICHARD;DAWIEDCZYK DANIEL LEE;DOYLE MATTHEW STEPHEN |
分类号 |
H05K3/20 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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