发明名称 Structure and method for flex circuit on a chip
摘要 A method of fabricating a multi-axis sensor is provided. The method includes forming patterns of sacrificial material overlaying a substrate and overlaying a flexible material on the sacrificial material and an anchor-surface of the substrate. The flexible material includes sensor-regions, an anchor-region, and at least one hinge-region. The method further includes forming sensor elements from orientable sensor material overlaying respective sensor-regions of the flexible material; forming at least one respective anchor-hinge in the flexible material along the boundary between the anchor-region and an adjacent sensor region; forming the sensor-regions, the anchor-region, and the at least one hinge-region in the flexible material; training the sensor elements to form respective oriented-sensor elements that are oriented in the same direction; etching the sacrificial material; and etching the substrate at an angle from the anchor-surface.
申请公布号 US8018229(B1) 申请公布日期 2011.09.13
申请号 US20100765040 申请日期 2010.04.22
申请人 HONEYWELL INTERNATIONAL INC. 发明人 HORNING ROBERT D.;RIDLEY JEFF A.;PANT BHARAT
分类号 G01R33/02 主分类号 G01R33/02
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