Semiconductor integrated circuit with multi-cut via and automated layout method for the same

摘要

A semiconductor integrated circuit according to an embodiment of the invention includes a single-cut via 60 and a multi-cut via 30 that includes a first via 30a and a second via 30b. An overhang (OHa or OHb) with respect to at least one of the first via 30a and the second via 30b is smaller than an overhang OH with respect to the single-cut via 60.