| 摘要 |
A thermal processing system is disclosed. The thermal processing system includes a transfer stage, one or more thermal processing chambers and an interface to a deposition equipment. The transfer stage is provided to receive workpieces for thermal processing. Further the transfer stage is provided as a mechanism to move workpieces from one chamber to another chamber. The thermal processing chamber includes a heat manipulation system to heat up or cool down the workpieces. The thermal processing chamber is designed to accommodate a platform that positions each of the workpieces vertically. As a result, all workpieces are moved together with the platform to be transferred, for example, from one chamber to another chamber. Depending on implementation, the platform may be implemented to include a fixture or a plurality of fixtures, where all of the workpieces may be removably held up by the fixture or each of the workpieces is removably held up by one of the fixtures.
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