| 摘要 |
A semiconductor die package. The semiconductor die package includes a leadframe structure comprising a first die attach pad, and a second die attach pad laterally spaced from the first die attach pad, a first side and a second side opposite to the first side. The semiconductor die package further includes a first semiconductor die attached the first die attach pad at the first side of the leadframe structure, and a second semiconductor die attached to the second die attach pad at the second side of the leadframe structure. The semiconductor die package further includes a housing material covering at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die.
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