| 摘要 |
An apparatus for manufacturing optical elements at wafer level includes a lower mold core, an upper mold core, an aligning plate and an image pick-up device. The lower mold core has a lower alignment mark. The upper mold core has an upper alignment mark. The aligning plate has a first middle alignment mark corresponding to the lower alignment mark and a second middle alignment mark corresponding to the upper alignment mark. The image pick-up device is configured for capturing and analyzing images of the alignment marks to align the lower mold core, the aligning plate and the upper mold core.
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