COOLING DEVICE AND COOLING METHOD

摘要

A cooling device is provided with a transfer means for transferring a resin composition formed into a sheet shape in the surface direction, and a cooling means for cooling the resin composition transferred by the transfer means. The resin composition has a temperature of 40 to 60°C just before being cooled by the cooling means, and the cooling means has a cooling capability of cooling the resin composition at a cooling speed of 0.2 to 5°C/second. Further, the cooling means comprises a blowing unit having at least one exhaust port from which cold air of -40 to 0°C is discharged toward the resin composition.