CUSTOMIZABLE INTERCONNECTIONS BETWEEN ELECTRONIC CIRCUITS

摘要

The present invention provides a method for creating electrical connections (304, 305, 309) between a plurality of electronic circuit tiles (110) on a same semiconductor die (308). The method comprises: selecting a plurality of electronic circuit tiles (110) for being diced together, i.e. in one block, from a wafer so as to create a die comprising multiple electronic circuit tiles (110); and customizing one or more electrically conductive layers of the created die to make electrical connections between the selected plurality of electronic circuit tiles (110). In doing so, a mask set of the plurality of electronic circuit tiles is defined separately from a mask set of the customized electrically conductive layer. The mask set of the plurality of electronic circuit tiles is kept fixed over a plurality of circuits formed by the circuit tiles while the mask set of the one or more electrically conductive layers is customized.