Electrical interconnection support structure i.e. interposer, fabricating method for e.g. micro electromechanical system integrated circuits, involves depositing electric contact point on upper face at level of wire, and removing backplate

摘要

The method involves forming conductive plugs on upper and lower faces of a substrate (1) i.e. wafer. A backplate is integrated with one of the plugs. A recess (6) traversing thickness of the substrate, is formed. A conductive wire (4) is formed inside the recess, where the wire connects the plugs. The recess is filled with insulating material (5) to electrically insulate the wire from the substrate. A portion of conductive wire is removed from the recess. An electric contact point (23) is deposited on the upper face at the level of the wire. The backplate is removed. An independent claim is also included for an integrated circuit interconnection support structure comprising a substrate.