MULTI-CHIP INTEGRATED CIRCUIT

摘要

A composite integrated circuit (IC, 100) combines a first IC die (chip, 102) having a first on-chip interconnect structure (1 14) and a second IC die (104) having a second on-chip interconnect structure (1 15) on a reconstructed wafer base (108). The second IC die is edge-bonded to the first IC die with oxide-to- oxide edge bonding (1 10). A chip-to-chip interconnect structure (1 18) electrically couples the first IC die and the second IC die. Methods of fabricating such a composite IC are also described.