发明名称 |
ELECTRONIC COMPONENT PACKAGE SEALING MEMBER, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR FABRICATING ELECTRONIC COMPONENT PACKAGE SEALING MEMBER |
摘要 |
<p>Disclosed is an electronic component package, wherein a stable conduction state is ensured at a penetration hole provided in a sealing member, and the inside of the electronic component package can be sufficiently sealed. An electronic component package comprises: a first sealing member (electronic component package sealing member) (4) and a second sealing member (6) which are disposed facing each other and hermetically seal electrodes (31, 32) of an electronic component element (2); an inner electrode (55) which is formed on a surface (42) that is on a base of the first sealing member (4) and faces the second sealing member (6), and an outer electrode (56) which is formed on a surface (43) that is on the base of the first sealing member (4) and faces the surface (42); a penetration hole (49) which penetrates the base of the first sealing member (4); and a penetration electrode (57) which is formed inside the penetration hole (49) through which the inner electrode (55) and the outer electrode (56) are electrically connected. At least one open surface of the penetration hole (49) is sealed by a resin material (58).</p> |
申请公布号 |
WO2011108715(A1) |
申请公布日期 |
2011.09.09 |
申请号 |
WO2011JP55106 |
申请日期 |
2011.03.04 |
申请人 |
DAISHINKU CORPORATION;KOHDA, NAOKI |
发明人 |
KOHDA, NAOKI |
分类号 |
H03H9/02;H01L23/02;H03H3/02 |
主分类号 |
H03H9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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