| 摘要 |
<p>A method of forming a focal plane array having at least one pixel (2) which is fabricated by: preparing a first wafer having sensing material (3) provided on a surface, which is covered by a first sacrificial layer; preparing a second wafer (9) including read-out integrated circuit (ROIC) and a contact pad, which is covered by a second sacrificial layer into which are formed support legs (7) in contact with the contact pad, the support legs being covered with a further sacrificial layer; bonding the sacrificial layers of the first and second wafers together such that the sensing material (3) is transferred from the first wafer to the second wafer (9) when a sacrificial bulk layer of the first wafer is removed; defining a pixel (2) in the sensing material and forming a conductive via (28) through the pixel for providing a connection between an uppermost surface of the pixel and the supporting legs; and removing the sacrificial oxide layers to release the at least one pixel, such that the supporting legs are arranged underneath it.</p> |
