| 摘要 |
A semiconductor package includes a semiconductor device and a substrate over which the semiconductor device is mounted, wherein the substrate includes: an internal ground electrode, formed in the one side of the substrate, which is connected to the semiconductor device; two external ground electrodes, located at the opposite side of the substrate opposite to the one side of the substrate, which are electrically connected to the internal ground electrode; at least one sub-ground electrode, located between the two external ground electrodes, when seen in a plan view, and located at the opposite side of the substrate, which is electrically connected to the internal ground electrode; an internal input electrode, formed in the one side of the substrate, which is connected to the semiconductor device; and an internal output electrode, formed in the one of the substrate, which is connected to the semiconductor device.
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