摘要 |
A housing for an electronic device. The housing includes a first shell at least partly enclosing the electronic device, a second shell, and at least a first fan. The first shell is arranged to allow a gaseous fluid to surround the electronic device. The second shell at least partly encloses the first shell, and is arranged in relation to the first shell such that the gaseous fluid may be present between the shells. The at least first fan is arranged in an opening of the first shell such that it is capable of providing a flow of the gaseous fluid through the opening in the first shell of the gaseous fluid to the second shell and thereby provide heat transport from the electronic device to the second shell.
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