CIRCUIT BOARD TO MOUNT SEMICONDUCTOR LIGHT EMITTING DEVICE, LIGHT EMITTING MODULE, AND LIGHTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a technology regarding improvement of heat dissipation performance of heat generated in a semiconductor light emitting device capable of toning.

SOLUTION: The semiconductor light emitting device has: a base material part which is equipped with at least a package, a semiconductor light emitting element, and a phosphor, and which is a circuit board in order to mount the semiconductor light emitting device, and is formed by using a heat conductive material on which the semiconductor light emitting device is mounted; and a power supply part to supply power to respective semiconductor light emitting elements by making at least one divided region part and the other divided region parts as a separated system out of a plurality of divided region parts which the package of the semiconductor light emitting device has. The power supply part is formed by using the heat conductive material, and in a planar state so as to cover the base material part.

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