发明名称 |
ADHESIVE COMPOSITION, ADHESIVE FILM AND SEPARATION METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition that comprises a polymer obtained by polymerizing a monomer composition containing a styrene-based monomer and has improved solubility rate in a solvent. SOLUTION: The adhesive composition comprises a polymer as a main component obtained by polymerizing a monomer composition containing styrene to which an alkyl group or an alkoxy group is introduced. The adhesive film is furnished with an adhesive layer containing the adhesive composition. The method for separating a wafer bonded by the adhesive composition from a substrate includes a step for dissolving the adhesive composition with a solvent selected from the group consisting of propylene glycol monomethyl ether acetate, 2-heptanone, butyl acetate and N-methylpyrrolidone. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011173955(A) |
申请公布日期 |
2011.09.08 |
申请号 |
JP20100037326 |
申请日期 |
2010.02.23 |
申请人 |
TOKYO OHKA KOGYO CO LTD |
发明人 |
IMAI HIROFUMI;TAMURA KOKI;ASAI TAKAHIRO;YOSHIOKA TAKAHIRO |
分类号 |
C09J125/16;C09J7/02;C09J125/08;H01L21/301;H01L21/304 |
主分类号 |
C09J125/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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