发明名称 THIN FILM FORMING APPARATUS AND THIN FILM FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To supply raw material gas of new type capable of preventing degradation of the quality of a thin film deposited on a substrate like the conventional apparatus when depositing a film by ALD (atomic layer deposition). SOLUTION: A thin film forming apparatus includes an evacuation vessel forming an evacuated film deposition space, and a raw material gas supply unit for supplying raw material gas to the film deposition space. The raw material gas supply unit includes a raw material gas pipe, a purge gas pipe, and a gas supply pipe for supplying raw material gas and purge gas to the film deposition space while the purge gas pipe, the raw material gas pipe and the purge gas pipe are connected to one another. First and second control valves are provided on the raw material gas pipe in the order closer from the connection part of the raw material gas pipe and the purge gas pipe. The raw material gas supply unit opens the second control valve, introduces raw material gas into the raw material gas pipe in an evacuated state between the first and second control valves, and supplies raw material gas into the film deposition space by performing the control to open the first control valve. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011174128(A) 申请公布日期 2011.09.08
申请号 JP20100038576 申请日期 2010.02.24
申请人 MITSUI ENG & SHIPBUILD CO LTD 发明人 MIYATAKE NAOMASA
分类号 C23C16/455;H01L21/31;H01L21/316;H01L21/318 主分类号 C23C16/455
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