| 摘要 |
PROBLEM TO BE SOLVED: To shorten a wiring path for connecting a data processing semiconductor chip to a memory semiconductor chip on a wiring board with the data processing semiconductor chip mounted thereon in a semiconductor device of a POP structure. SOLUTION: The POP structure is adopted, wherein, in regards to alignment of data package terminal groups (210, 211) and address command package terminal group (212) of a package substrate on which a memory semiconductor chip is mounted, and alignment of data chip terminal groups (110, 111) and address command chip terminal group (112) of a data processing semiconductor chip on the wiring board (100) for mounting the terminal groups, the data chip terminal groups are divided and arranged in different regions in edge side parts of the data processing semiconductor chip by corresponding to arrangement of the data package terminal groups, and the address command chip terminal group is arranged in the edge side part of the data processing semiconductor chip by corresponding to arrangement of the address command package terminal group. COPYRIGHT: (C)2011,JPO&INPIT |
