| 摘要 |
PROBLEM TO BE SOLVED: To provide a matrix substrate sheet which, when a plurality of individual semiconductor package substrates which are arranged are processed by dicing, can suppress the contamination of surfaces of the semiconductor package substrates, and also to provide the semiconductor package substrates, and the methods of manufacturing the matrix substrate sheet and the semiconductor package substrates. SOLUTION: The matrix substrate sheet is formed by arranging the plurality of semiconductor package substrates including a base material, a wiring pattern provided on the base material, and solder resist formed on the base material and wiring pattern. The matrix substrate sheet is configured to have, at each of boundaries between the plurality of semiconductor package substrates which are arranged: a relief part of the wiring pattern; solder resist forming a recessed part at the relief part; a dicing region provided in the relief part; and a groove part of the solder resist provided in the dicing region. The semiconductor package substrates are fabricated by dicing the matrix substrate sheet. Then, the methods of manufacturing the matrix substrate sheet and the semiconductor package substrates are provided. COPYRIGHT: (C)2011,JPO&INPIT
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