发明名称 PRECISE PROCESSING METHOD AND DEVICE OF HARD-TO-PROCESS MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a precise processing method and a device of a hard-to-process material for high-efficiency generating a scratch-free and damage-free surface of high quality, by having the surface of the hard-to-process material made of a cemented carbide such as SiC, GaN or WC irradiated with high-density radicals generated with an atmospheric-pressure plasma to reform the mechanical properties of the surface to attain easy removal through mechanical polishing, such as, lapping or polishing. <P>SOLUTION: The method includes a surface reforming process of reforming the surface of the hard-to-process material by making a high-reactivity oxide species generated with the atmospheric-pressure plasma act on the surface to form a surface reformed layer on the hard-to-process material, and a polishing process of selectively removing the surface reformed layer, without introducing a scratch or an affected layer into the hard-to-process material and using a polishing mechanism higher in removing rate to the surface reformed layer than to the hard-to-process material to process the material, by alternately making it repeat or the surface reforming process and the polishing process proceed simultaneously. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011176243(A) 申请公布日期 2011.09.08
申请号 JP20100041092 申请日期 2010.02.25
申请人 OSAKA UNIV 发明人 YAMAMURA KAZUYA;ZETTSU NOBUYUKI
分类号 H01L21/304;B24B37/04;B24B37/26 主分类号 H01L21/304
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