| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide silica particles which have a sharp particle size distribution, and a low water absorption rate, and can be used suitably as a filler for a sealing resin composition; a process for producing the silica particles; and a resin composition comprising the silica particles and a resin. <P>SOLUTION: The silica particles have a water absorption rate of less than 1.0% when measured for 500 hours under the conditions of a temperature of 50°C and a humidity of 90%, and the conditions of a temperature of 85°C and a humidity of 85%, a D90/D10 value of 3 or less, a true specific gravity of 2.1 g/cm<SP>3</SP>or more, and an average particle diameter of 10μm or less. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
