| 摘要 |
PROBLEM TO BE SOLVED: To solve the following problem: since Sn-Pb-based solder with a low melting point is used to join a metal frame onto a thick film conductor formed on a surface of a low-temperature baked ceramic substrate, Sn-Pb-based solder cannot be used for secondary mounting of an airtight semiconductor device, and a configuration in which a carrier is attached to an airtight semiconductor device and screwed to a chassis is employed to require large mounting area and much cost. SOLUTION: The package for airtight sealing is constituted by baking and joining a high-temperature baked ceramic substrate to the low-temperature baked ceramic substrate 1 via the thick film conductor, and joining the metal frame 4 to the thick film conductor formed on the surface of the high-temperature baked ceramic substrate with An-Sn-based solder. COPYRIGHT: (C)2011,JPO&INPIT
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