| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve productivity in a system and method for manufacturing a semiconductor device in an in-line configured lithography process. <P>SOLUTION: When wafers from a cassette E are subjected to lithography processing by the system for manufacturing the semiconductor device in an in-line configuration, a first wafer is only passed through a coating device A without being coated, and fed directly to an exposure device B, where optimization alignment operation of the first wafer is carried out. As main operation, second and succeeding wafers are fed to the coating device A one after another to be subjected to coating processing in parallel with the optimization alignment operation of the first wafer. After optimization alignment operation conditions of the exposure device B are determined, the second wafer is fed to the exposure device B. The optimization alignment operation conditions of the exposure device B are fed back for the second wafer, so that an exposure processing time of the second wafer is shortened. The first wafer is processed successively to a final X-th wafer. <P>COPYRIGHT: (C)2011,JPO&INPIT |
