发明名称 METHOD AND APPARATUS FOR BONDING METALS AND COMPOSITES
摘要 Apparatus, systems and methods for forming a structure that includes a metal and a composite material are disclosed. According to one aspect, a layer stack includes a metal layer with a first surface, the first surface including at least one protruding feature. The layer stack also includes a non-metal layer molded to the first surface of the metal layer, wherein the non-metal layer is molded over and/or around the at least one protruding feature.
申请公布号 US2011216481(A1) 申请公布日期 2011.09.08
申请号 US20100715702 申请日期 2010.03.02
申请人 发明人 LYNCH STEPHEN BRIAN
分类号 H05K7/00;B23K31/02;B32B3/30;H05K1/00;H05K1/11 主分类号 H05K7/00
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