发明名称 CUTTING FLUID COMPOSITION FOR WIRESAWING
摘要 The present invention provides an aqueous wiresaw cutting fluid composition that reduces the amount of hydrogen produced during a wiresaw cutting process. The composition is comprised of an aqueous carrier, a particulate abrasive, a thickening agent, and a hydrogen suppression agent.
申请公布号 KR20110099748(A) 申请公布日期 2011.09.08
申请号 KR20117016869 申请日期 2009.12.21
申请人 CABOT MICROELECTRONICS CORPORATION 发明人 GRUMBINE STEVEN;NAGUIB NEVIN
分类号 C09K3/14;H01L21/304 主分类号 C09K3/14
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