| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board having a low process cost and a high yield by simplifying the structure of the printed circuit board, and capable of improving the joining property of a fine bump and reliability at the time of flip-chip bonding, a semiconductor package, an electric and electronic device, a manufacturing method of the printed circuit board, and a manufacturing method of the semiconductor package. <P>SOLUTION: Disclosed are the printed circuit board including a wiring pattern 120 of a body resin layer 100, a through-hole contact, and a solder resist (SR) 130 defining the opening of a solder ball land A' and a bump land B', a semiconductor package 1000b, an electric and electronic device, a manufacturing method of the printed circuit board, and a manufacturing method of the semiconductor package. When the solder ball land is formed on the wiring pattern, the bump land is formed at least on one of the through-hole contacts, and when the bump land is formed on the wiring pattern, the solder ball land is formed at least on one of the through-hole contacts. <P>COPYRIGHT: (C)2011,JPO&INPIT |
