| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technology of improving a designing flexibility of a mounting substrate to which a semiconductor chip is wire bonded. <P>SOLUTION: The mounting substrate 1 is equipped with: an anodic oxidation layer 12 on which a plurality of linear conductors 11 extending in parallel with each other are formed in the thickness direction; an insulating layer 13 formed on the main surface of the anodic oxidation layer 12; an insulating layer 14 formed on the rear surface of the anodic oxidation layer 12; a wire bond pad 17 provided on the anodic oxidation layer 12 in an opening 15 formed in the insulating layer 13; and a terminal 18 provided on the anodic oxidation layer 12 in an opening 16 formed in the insulating layer 14. Each of the plurality of linear conductors 11 is provided with a connecting part 21 which has one end bonded to the wire bond pad 17 and the other end bonded to the terminal 18, wherein the wire bond pad 17, the connecting part 21, and the terminal 18 are located in the same position in the plan view of the anodic oxidation layer 12. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
