| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrode, an electronic component and a substrate which are capable of controlling decrease in junction area between the body of the electrode and the electronic component or the substrate. SOLUTION: The electrode 10 is provided while being soldered to the electronic component 12 and it is soldered to the electronic component 12 when the electronic component 12 is mounted on the substrate 13. The electrode 10 is provided with a pillar type electrode body 11 to be soldered to the electronic component 12 and the substrate 13. The electrode is provided with grooves 20 as air discharging means for discharging air 15a in air accumulation 15, which is generated in the solder 14 between the junction surfaces 11a, 11b of the electrode body 11 and the electronic component 12 or the substrate 13 when the electrode body 11 is soldered to the electronic component 12 or the substrate 13. COPYRIGHT: (C)2011,JPO&INPIT
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