| 摘要 |
PROBLEM TO BE SOLVED: To improve the throughput of substrate processing while suitably performing surface processing on a substrate in an inexpensive method. SOLUTION: On a surface 12a of a template 12, a plurality of openings 15 are formed in positions for surface modification on a surface Wa of a wafer W. The template 12 has a flow passage 16 for a surface modifying liquid which communicates with the openings 15. After the template 12 and wafer W are brought into contact with each other and while the state is kept as it is, the surface modifying liquid is supplied from a surface modifying liquid supply opening 12 to the surface Wa of the wafer W in the predetermined position through the flow passage 16 from openings 15 to modify the surface Wa of the wafer W. COPYRIGHT: (C)2011,JPO&INPIT
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