| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible printed board by which metal residues between wiring lines are removed through an inexpensive and easy process without performing side etching of a copper layer and even a microwiring processed article has sufficient insulation reliability, and also to provide the printed wiring board obtained by the manufacturing method. SOLUTION: The method of manufacturing the flexible printed board is characterized by maintaining an oxygen concentration in an etching processing atmosphere at 2 vol.% or below in a process of forming a copper wiring pattern by performing etching processing on a copper coating layer formed at least on one surface of an insulator film without interposing an adhesive. COPYRIGHT: (C)2011,JPO&INPIT
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