发明名称 ZAPPING ELEMENT AND SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To reduce a manufacturing cost of a zapping element while reducing a breakdown voltage of the zapping element. SOLUTION: The width of a gate electrode 14 of the zapping element 100 is processed to be partially narrow. That is, the gate electrode 14 includes a first gate electrode 14N having a small first gate width W1 at the center, and second gate electrodes 14W with large second gate widths W2 at both sides. The first channel length LC1 of a channel region CH corresponding to the first gate electrode 14N is thereby shorter than a second channel length LC2 of a channel region CH corresponding to the second gate electrode 14W. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011175992(A) 申请公布日期 2011.09.08
申请号 JP20100036877 申请日期 2010.02.23
申请人 ON SEMICONDUCTOR TRADING LTD 发明人 OTAKE SEIJI
分类号 H01L21/82;H01L21/822;H01L27/04 主分类号 H01L21/82
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