| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package having high durability and low cost, and to provide a method of manufacturing the same. <P>SOLUTION: The LED package includes: first and second leadframes, which are disposed on the same plane, and are separated from each other; an LED chip, which is provided above the first and the second leadframes, has one terminal connected to the first leadframe, and the other terminal connected to the second leadframe; and a resin material. The resin material covers the LED chip, and also part of the upper, lower, and edges of respective first and second leadframes, and exposes the rest of the lower surface and the rest of the edge. <P>COPYRIGHT: (C)2011,JPO&INPIT |
