| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing of a chip-type electronic component that eliminates the need for work of separating an element body from a medium, capable of reliably forming a plating film on a surface of a base electrode layer formed on an end surface of the element body, and in which a surface of the element body could be hardly damaged. <P>SOLUTION: The method is provided for manufacturing the chip-type electronic component 2 having the element body 10 formed with internal electrodes 4, 6 inside, and terminal electrodes 12, 14 covering an end surface of the element body 10 where the internal electrodes 4, 6 are exposed. The base electrode layers 12p, 14p are formed on the end surface of the element body 10. A plurality of the element bodies 10 each of which is formed with the base electrode layers 12p, 14p are stored inside a concave container 20a. While liquid is stored inside the concave container 20a, the concave container 20a is rotated at first rotation speed to move the element bodies 10 to a position near an inner wall surface on a bottom surface 20a of the concave container. The concave container 20a is rotated at second rotation speed faster than the first rotation speed to move the element bodies 10 upward along the inner wall surface 23a. The rotation of the concave container 20a is stopped. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
