| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting (meth)acrylic resin composition capable of obtaining a molded article excellent in manufacturing aptitude and a handling property and moldability of SMC and BMC and excellent in appearance, heat-resistance and solvent-resistance, and SMC, BMC and a molded article using it. SOLUTION: The thermosetting (meth)acrylic resin composition for preparing the sheet molding compound or the bulk molding compound includes (meth)acrylic polymer powder (A) having a weight average molecular weight of 50,000-500,000, methyl methacrylate monomer (B), multi-functional (meth)acrylic monomer (C) containing a substance having a boiling point of 150°C or higher, inorganic filler (D), organic peroxide (E), and organic solvent (F) having a lower boiling point than the methyl methacrylate monomer (B). COPYRIGHT: (C)2011,JPO&INPIT
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