发明名称 |
THERMOSETTING RESIN COMPOSITION, B-STAGE HEAT CONDUCTIVE SHEET, AND POWER MODULE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition providing a heat conductive sheet of excellent heat conductivity while holding an electric insulating property by controlling the generated part and a magnitude of a defect such as a void and a crack, and a B-stage heat conductive sheet. <P>SOLUTION: The thermosetting resin composition includes an inorganic filler and thermosetting resin 5. The inorganic filler contains secondary sintered particles 1 composed of primary particles 6 of scale-like boron nitrides, and at least part of the secondary sintered particles has a maximum pore diameter 7 of 5 μm or larger and 80 μm or smaller. The B-stage heat conductive sheet is formed by dispersing the inorganic filler in the thermosetting resin in a B-stage state. The inorganic filler contains secondary sintered particles composed of primary particles of scale-like boron nitrides, and at least part of the secondary sintered particles has a maximum pore diameter of 5 μm or larger and 80 μm or smaller. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011176024(A) |
申请公布日期 |
2011.09.08 |
申请号 |
JP20100037501 |
申请日期 |
2010.02.23 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
YAMAMOTO KEI;NISHIMURA TAKASHI;MIMURA KENJI;MASAKI MOTOKI |
分类号 |
H01L23/36;C08K7/00;C08L101/00;H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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