| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To update efficiently an inspection recipe, when inspecting a defect of a substrate. <P>SOLUTION: A wafer is imaged to acquire a reference image (step S1), and an inspection recipe including the reference image is stored in a storage part (step S3). The wafer is imaged based on the inspection recipe to acquire an inspection object image (step S4), and a defect of the wafer is inspected based on the inspection recipe and the inspection object image (step S10). A recipe including the inspection object image, an inspection result or the like is stored in the storage part (step S11). The step S4 to step S11 are repeated, and when an inspection object image satisfying a prescribed condition is stored in the storage part, the inspection recipe stored in the storage part is updated based on the recipe including the inspection object image (step S12). Thereafter, the step S4 to step S11 are performed based on the updated inspection recipe, so that a defect of the wafer is detected. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
