摘要 |
PROBLEM TO BE SOLVED: To provide a mobile terminal for attaining thinning, while maintaining strength, by integrally molding a board and a sheet metal with a frame resin, and also reducing the number of components and the man-hour of attachment so as to suppress nonuniformity in attachment position. SOLUTION: The mobile terminal incorporates a resin frame 21 in which an electronic circuit is mounted. The resin frame 21 is configured to integrally mold the board 22 and the sheet metal 23. COPYRIGHT: (C)2011,JPO&INPIT
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