发明名称 METHOD OF INSPECTING PRINTED CIRCUIT BOARD USED FOR ELECTRONIC DEVICES AND INSPECTION DEVICE USED THEREFOR
摘要 PROBLEM TO BE SOLVED: To inspect a printed circuit board wherein electronic parts covered with flux are mounted by contacting a probe to the printed circuit board. SOLUTION: A probe is heated from the root of a probe substrate wherein the probe is erected, by means of a cable from a heating substrate 60. The temperature of the probe is measured by a temperature detector attached to the probe, and the heater 65 of the heating substrate 60 is controlled. The probe is pressed down to the pad of a mounting printed circuit board as a reference wherein parts are mounted, and the flux of the printed circuit board is softened by the heated probe and connected with solder on the pad, thereby measuring a resistance value. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011174863(A) 申请公布日期 2011.09.08
申请号 JP20100040274 申请日期 2010.02.25
申请人 TATSUMO KK 发明人 ISHIOKA SEIGO;KANAISHI YUKIO
分类号 G01R31/02;H05K3/00 主分类号 G01R31/02
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