发明名称 |
Stacked Semiconductor Package Having Discrete Components |
摘要 |
A stacked semiconductor package includes a substrate and a plurality of semiconductor dice stacked on the substrate. Each semiconductor die includes a recess, and a discrete component contained in the recess encapsulated in a die attach polymer. The stacked semiconductor package also includes interconnects electrically connecting the semiconductor dice and discrete components, and an encapsulant encapsulating the dice and the interconnects.
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申请公布号 |
US2011215438(A1) |
申请公布日期 |
2011.09.08 |
申请号 |
US201113110275 |
申请日期 |
2011.05.18 |
申请人 |
KWANG CHUA SWEE;POO CHIA YONG |
发明人 |
KWANG CHUA SWEE;POO CHIA YONG |
分类号 |
H01L29/02;H01L23/48 |
主分类号 |
H01L29/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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