| 摘要 |
<P>PROBLEM TO BE SOLVED: To maintain quality and to improve product yield, without causing increase in the manufacturing man-hours, for a light-emitting device (an LED package) which uses a slit substrate. <P>SOLUTION: Projection structures are provided so as to surround a slit on both sides of the slit on the rear face side of the substrate mounted with LED elements. At manufacturing, the substrate is gripped by a vacuum chuck and sealed with translucent resin through compression molding, a space formed by the slit and projections is thereby filled with the translucent resin, and leakage of the translucent resin to the outside from the projections is prevented. <P>COPYRIGHT: (C)2011,JPO&INPIT |
