| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging element package capable of reducing warpage occurring in a casing or an optical low-pass filter constituent member due to difference of a thermal expansion coefficient. SOLUTION: The imaging element package is composed by including: a housing, having an opening, for holding an imaging element; an optical low-pass filter constituent member for closing the opening; and a point-contact member for bringing the housing and the optical low-pass filter constituent member into point contact with each other. The imaging element package is further composed by sticking the housing and the optical low-pass filter constituent member to each other by an adhesive in the state where the housing and the optical low-pass filter constituent member are brought into point contact with each other by the point-contact member. COPYRIGHT: (C)2011,JPO&INPIT |
