| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an optical device component that has high reliability of reception/emission of light when a lens barrel is jointed to a lens via lead-free solder, and to provide an optical device. <P>SOLUTION: The optical device component includes: a lens 3 to which a metal layer 4 is attached so as to cover the outside surface of the lens; and a lens barrel 1 at least a part of the inside surface of which is made of a metal material to the surface of which a solder layer 2 is attached so as to cover the outside surface of the metal material, wherein the metal layer 4 is joined to the metal material of the lens barrel 1 via the solder layer 2. In the optical device component, the solder layer 2 contains, in order from the lens barrel 1 side, a first solder layer 2a containing, as a principal component, an alloy phase of tin and the metal component of a metal material, and a second solder layer 2b containing a tin-bismuth alloy phase with a bismuth phase as its principal component, and having a melting point lower than that of the first soldering layer 2b. Since the alloy phase of the tin-metal component and bismuth phase have relatively high melting points, melting of, upon jointing, the first layer to an outside portion is suppressed, and high reliability in reception/emission of light is attained. In addition, the soldering layer 2 does not contain lead. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
