发明名称 PRESS APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To suppress the overheat of a sliding portion of a press apparatus. <P>SOLUTION: The press apparatus 100 includes a bolster 1 and a lower die holder 2 that is mounted on the bolster 1 and on which a lower die (for example, die plate 7 and die 8) is to be provided. The press apparatus 100 further includes: guide posts 3 arranged in a standing condition on the lower die holder 2; guide bushes 4 which are slid along the guide posts 3; and an upper die holder 5 which is fixed to the guide bushes 4 and on which an upper die (for example, punch plate 9 and punches 10) is provided. The press apparatus 100 further includes heat transfer accelerating portions 6 which contact the guide posts 3 and the bolster 1 and accelerate the transfer of heat from the guide posts 3 to the bolster 1. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011173164(A) 申请公布日期 2011.09.08
申请号 JP20100040817 申请日期 2010.02.25
申请人 RENESAS ELECTRONICS CORP 发明人 KUMAMOTO TORU
分类号 B21D5/01;B21D37/10;H01L23/50 主分类号 B21D5/01
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