| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sensor device, capable of securing parallelism between a package and a sensor chip, even if the sensor chip having a movable electrode is mounted onto the package with an adhesive agent, and capable of preventing degradation of a stress shutoff capability of the adhesive agent, and to provide a method of manufacturing the same. <P>SOLUTION: The adhesive agent 20 formed with a silicone resin for adhering a ceramic package 2 and a circuit chip 3 contains a plurality of first adhesive agents 21 formed at the same height as spacers keeping a constant distance between the ceramic package 2 and the circuit chip 3, and a second adhesive agent 22 disposed in a gap between the ceramic package 2 and the circuit chip 3 formed by the first adhesive agents 21 and adhering the ceramic package 2 and the circuit chip 3. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
