发明名称 METHOD FOR MANUFACTURING SUBSTRATE FOR ELECTRIC SOLID DEVICE AND ELECTRIC SOLID DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate for an electric solid device, by which a thin substrate for an electric solid device can be efficiently obtained from a large glass substrate after a functional layer is formed thereon, and to provide an electric solid device having the substrate for an electric solid device. SOLUTION: Two large glass substrates 200 (a first large glass substrate 201 and a second large glass substrate 202) are prepared as a panel body 300 by laminating the substrates with one surface 200a having a functional layer 29 formed thereon of each substrate bonded to each other; the other surfaces 200b of the large glass substrates 200 as in a state of the panel body 300 are etched to reduce the thickness of the large glass substrates 200; then the two large glass substrates 200 are cut as in the state of the panel body 300 to obtain a substrate 20 for a touch panel from each of the two large glass substrates 200. In the panel body 300, a spacer 283 is present between the two large glass substrates 200. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011175061(A) 申请公布日期 2011.09.08
申请号 JP20100038389 申请日期 2010.02.24
申请人 SONY CORP 发明人 KAMIJO YOICHI
分类号 G09F9/30;G02F1/13;G02F1/1333;G02F1/1339;G09F9/00 主分类号 G09F9/30
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