发明名称 |
PHOTORESIST REMOVING PROCESSOR AND METHODS |
摘要 |
A processing chamber successfully removes hardened photoresist via direct infrared radiation onto the wafer, in the presence of an acid such as sulfuric acid, optionally along with an oxidizer such as hydrogen peroxide. The processing chamber includes a fixture for holding and optionally rotating the wafer. An infrared irradiating assembly has infrared lamps outside of the processing chamber positioned to radiate infrared light into the processing chamber. The infrared lamps may be arranged to irradiate substantially the entire surface of a wafer on the rotor. A cooling assembly can be associated with the infrared radiating assembly to provide a quick cool down and avoid over-processing. Photoresist is removed using small amounts of chemical solutions.
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申请公布号 |
US2011217848(A1) |
申请公布日期 |
2011.09.08 |
申请号 |
US20100717079 |
申请日期 |
2010.03.03 |
申请人 |
BERGMAN ERIC J;LEONHARD JERRY DUSTIN;PUCH BRYAN;RYE JASON |
发明人 |
BERGMAN ERIC J.;LEONHARD JERRY DUSTIN;PUCH BRYAN;RYE JASON |
分类号 |
H01L21/306 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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